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Electronic Devices And Circuits — Part 2 MCQs with Explanations

Practice high-yield Electronics & Communications Engineering MCQs on Electronic Devices And Circuits — Part 2 with worked academic solutions for FPSC, PPSC, PTA, PAEC, NTS.

Questions
40
Difficulty Level
Exam-Level
Target Exams
FPSC, PPSC, PTA...
Estimated Time
48 mins
Exam-Level FPSC PPSC PTA PAEC NTS
Verified for Commission Syllabus • Oct 14, 2026
40

Verified Practice Questions

Interactive test mode with detailed academic worked solutions

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Question 1 of 40
★ FPSC ★ PPSC

As compared to bipolar junction transistor, a FET

Question 2 of 40
★ FPSC ★ PPSC

The most commonly used semiconductor material is

Question 3 of 40
★ FPSC ★ PPSC

Permalloy is

Question 4 of 40
★ FPSC ★ PPSC

Which one of the following is not a characteristic of a ferroelectric material?

Question 5 of 40
★ FPSC ★ PPSC

In which of these is reverse recovery time nearly zero?

Question 6 of 40
★ FPSC ★ PPSC

Hall effect is observed in a specimen when it is carrying current and is placed in a magnetic field. The resultant electric field inside the specimen is

Question 7 of 40
★ FPSC ★ PPSC

Fermi level is the amount of energy in which

Question 8 of 40
★ FPSC ★ PPSC

In monolithic ICs, all the components are fabricated by

Question 9 of 40
★ FPSC ★ PPSC

When diodes are connected in series to increase voltage rating the peak inverse voltage per junction

Question 10 of 40
★ FPSC ★ PPSC

If fixed positive charges are present in the gate oxide of an n-channel enhancement type MOSFET, it will lead to

Question 11 of 40
★ FPSC ★ PPSC

The main drawback of JFET is its

Question 12 of 40
★ FPSC ★ PPSC

If a donor type impurity is added to the semiconductor, then at a given temperature, the Fermi Level

Question 13 of 40
★ FPSC ★ PPSC

In PN junction diode, P side is doped with acceptor concentration of 2 × 10 16 cm -3 , N side is doped donor concentration of 5 × 10 17 cm -3 . The contact potential of diode is: Assume thermal equivalent voltage equal to 26 mV and intrinsic carrier concentration equal to 1.45 × 10 10 cm -3 .

Question 14 of 40
★ FPSC ★ PPSC

A diode which resembles a voltage variable capacitor is known as

Question 15 of 40
★ FPSC ★ PPSC

Find the wrong statement: specific heat of a material is

Question 16 of 40
★ FPSC ★ PPSC

The capacitance of a reverse-biased PN junction

Question 17 of 40
★ FPSC ★ PPSC

Thermionic emission occurs in

Question 18 of 40
★ FPSC ★ PPSC

The stability of fixed bias circuit

Question 19 of 40
★ FPSC ★ PPSC

The Integrated Circuit used in computers is made of which element?

Question 20 of 40
★ FPSC ★ PPSC

The semiconductor bar is heated at one end, a voltage across the bar is developed. If the heated end is positive, the semiconductor is

Question 21 of 40
★ FPSC ★ PPSC

In PN-junction diode, if doping concentration of acceptor atoms in P-region is increased then

Question 22 of 40
★ FPSC ★ PPSC

The output current versus input voltage transfer characteristics of an n-channel JFET is such that there is

Question 23 of 40
★ FPSC ★ PPSC

. . . . . . . . of the varactor-diode changes with the change in applied voltage.

Question 24 of 40
★ FPSC ★ PPSC

The reverse saturation current of a silicon diode doubles for every

Question 25 of 40
★ FPSC ★ PPSC

The leakage current in CE configuration may be around

Question 26 of 40
★ FPSC ★ PPSC

For the 2N338 transistor, the manufacturer specifies P max = 100 mW at 25°C free air temperature and the maximum junction temperature, T jmax = 125°C. Its thermal resistance is

Question 27 of 40
★ FPSC ★ PPSC

The band gap energies for silicon and germanium photodiodes are 1.1 eV and 0.67 eV respectively, their cutoff wavelength respectively would be:

Question 28 of 40
★ FPSC ★ PPSC

Consider the following statements S 1 and S 2 . S 1 : The threshold voltage (V T ) of a MOS capacitor decreases with increase in gate oxide thickness. S 2 : The threshold voltage (V T ) of a MOS capacitor decreases with increase in substrate doping concentration. Which one of the following is correct?

Question 29 of 40
★ FPSC ★ PPSC

Consider the following statements S1: Silicon is indirect bandgap semiconductor S2: Germanium is direct bandgap semiconductor S3: Gallium Arsenide is direct bandgap semiconductor S4: Indium Phosphide is indirect bandgap semiconductor

Question 30 of 40
★ FPSC ★ PPSC

Which of the following statements are correct for the basic transistor amplifier configurations

Question 31 of 40
★ FPSC ★ PPSC

The band gap in eV of Si at 300 K is:

Question 32 of 40
★ FPSC ★ PPSC

Swept-out voltage in PIN diode happens when PIN diode is

Question 33 of 40
★ FPSC ★ PPSC

What happens to a diode, if the PIV rating of the diode is exceeded?

Question 34 of 40
★ FPSC ★ PPSC

The energy required to change the speed of one electron from rest to 0.6c is nearly:

Question 35 of 40
★ FPSC ★ PPSC

When silicon is doped with arsenic, each arsenic atom will give the crystal . . . . . . . .

Question 36 of 40
★ FPSC ★ PPSC

In the fabrication of n-p-n transistor in an IC, the buried layer on the p-type substrate is

Question 37 of 40
★ FPSC ★ PPSC

Dominant mechanism for motion of charge carriers in forward and reverse biased silicon p-n junctions are

Question 38 of 40
★ FPSC ★ PPSC

The main purpose of the metallization process is

Question 39 of 40
★ FPSC ★ PPSC

A gate to drain connected enhancement mode MOSFET is an example of

Question 40 of 40
★ FPSC ★ PPSC

How much "holes carrier" emitted by the emitter recombines with the electrons in the base in a PNP type transistor?

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In competitive commission exams (FPSC, PPSC, KPPSC, SPSC, CSS, PMS), questions are frequently phrased with distractor options designed to catch rote learners. Whenever you answer an MCQ, read the Detailed Academic Explanation and Conceptual Anchor to understand why the remaining options are incorrect.

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