Vlsi Design And Testing — Part 1 MCQs with Explanations
Practice high-yield Electronics & Communications Engineering MCQs on Vlsi Design And Testing — Part 1 with worked academic solutions for FPSC, PPSC, PTA, PAEC, NTS.
Questions
40
Difficulty Level
Exam-Level
Target Exams
FPSC, PPSC, PTA...
Estimated Time
48 mins
Exam-Level FPSC PPSC PTA PAEC NTS
Verified for Commission Syllabus • Oct 14, 2026
40
Verified Practice Questions
Interactive test mode with detailed academic worked solutions
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🎉 Set complete! All 40 questions answered.
Question 1 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Contact cuts are made in . . . . . . . . .
Correct Answer: Option A — Source
Detailed Academic Explanation:
Source is the correct answer to “Contact cuts are made in . . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 2 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The dopants are introduced in the active areas of silicon by using which process?
Correct Answer: Option D — Either Diffusion or Ion Implantation Process
Detailed Academic Explanation:
Either Diffusion or Ion Implantation Process is the correct answer to “The dopants are introduced in the active areas of silicon by using which process”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 3 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Which is used for the interconnection?
Correct Answer: Option C — Aluminium
Detailed Academic Explanation:
Aluminium is the correct answer to “Which is used for the interconnection”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 4 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
What are the advantages of E-beam masks?
Correct Answer: Option A — Small feature size
Detailed Academic Explanation:
Small feature size is the correct answer to “What are the advantages of E-beam masks”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 5 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
In nMOS fabrication, etching is done using . . . . . . . . .
Correct Answer: Option A — Plasma
Detailed Academic Explanation:
Plasma is the correct answer to “In nMOS fabrication, etching is done using . . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 6 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Depletion mode MOSFETs are more commonly used as . . . . . . . .
Correct Answer: Option B — Resistors
Detailed Academic Explanation:
Resistors is the correct answer to “Depletion mode MOSFETs are more commonly used as . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
Increases is the correct answer to “Increasing Vsb . . . . . . . . the threshold voltage.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 8 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Which process produces a circuit which is less prone to latch-up effect?
Correct Answer: Option D — BiCMOS
Detailed Academic Explanation:
BiCMOS is the correct answer to “Which process produces a circuit which is less prone to latch-up effect”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 9 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Positive photo resists are used more than negative photo resists because . . . . . . . .
Correct Answer: Option A — Negative photo resists are more sensitive to light, but their photo lithographic resolution is not as high as that of the positive photo resists
Detailed Academic Explanation:
Negative photo resists are more sensitive to light, but their photo lithographic resolution is not as high as that of the positive photo resists is the correct answer to “Positive photo resists are used more than negative photo resists because . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 10 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
N-well is formed by . . . . . . . .
Correct Answer: Option B — Diffusion
Detailed Academic Explanation:
Diffusion is the correct answer to “N-well is formed by . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 11 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Which of the following is true when inputs are controlled by equal amounts of charge?
Correct Answer: Option A — Cg(MOS) = Cbase(bipolar)
Detailed Academic Explanation:
Cg(MOS) = Cbase(bipolar) is the correct answer to “Which of the following is true when inputs are controlled by equal amounts of charge”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 12 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Switching speed of a MOS device depends on . . . . . . . .
Correct Answer: Option D — All of the mentioned
Detailed Academic Explanation:
All of the mentioned is the correct answer to “Switching speed of a MOS device depends on . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 13 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
MOS transistor structure is . . . . . . . .
Correct Answer: Option A — Symmetrical
Detailed Academic Explanation:
Symmetrical is the correct answer to “MOS transistor structure is . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 14 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
In latch-up condition, parasitic component gives rise to . . . . . . . . conducting path.
Correct Answer: Option A — Low resistance
Detailed Academic Explanation:
Low resistance is the correct answer to “In latch-up condition, parasitic component gives rise to . . . . . . . . conducting path.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 15 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The isolated active areas are created by technique known as . . . . . . . .
Correct Answer: Option C — Etched field-oxide isolation or Local Oxidation of Silicon
Detailed Academic Explanation:
Etched field-oxide isolation or Local Oxidation of Silicon is the correct answer to “The isolated active areas are created by technique known as . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 16 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Increasing the transconductance . . . . . . . .
Correct Answer: Option A — Increases input capacitance
Detailed Academic Explanation:
Increases input capacitance is the correct answer to “Increasing the transconductance . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 17 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Latch-up is the generation of . . . . . . . .
Correct Answer: Option A — Low impedance path
Detailed Academic Explanation:
Low impedance path is the correct answer to “Latch-up is the generation of . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 18 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Transconductance gives the relationship between . . . . . . . .
Correct Answer: Option B — Output current and input voltage
Detailed Academic Explanation:
Output current and input voltage is the correct answer to “Transconductance gives the relationship between . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 19 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
If p-transistor is conducting and has small voltage between source and drain, then it is said to work in . . . . . . . .
Correct Answer: Option C — Non saturation resistive region
Detailed Academic Explanation:
Non saturation resistive region is the correct answer to “If p-transistor is conducting and has small voltage between source and drain, then it is said to work in . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 20 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Interconnection pattern is made on . . . . . . . .
Correct Answer: Option C — Metal layer
Detailed Academic Explanation:
Metal layer is the correct answer to “Interconnection pattern is made on . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 21 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The n-well collector is formed by . . . . . . . . .
Correct Answer: Option A — Lightly doped n-type epitaxial layer on p-Substrate
Detailed Academic Explanation:
Lightly doped n-type epitaxial layer on p-Substrate is the correct answer to “The n-well collector is formed by . . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 22 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The current Ids . . . . . . . . as Vds increases.
Correct Answer: Option C — Remains fairly constant
Detailed Academic Explanation:
Remains fairly constant is the correct answer to “The current Ids . . . . . . . . as Vds increases.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 23 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
As die size shrinks, the complexity of making the photomasks . . . . . . . .
Correct Answer: Option A — Increases
Detailed Academic Explanation:
Increases is the correct answer to “As die size shrinks, the complexity of making the photomasks . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 24 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
In BiCMOS, MOS switches are used to . . . . . . . .
Correct Answer: Option C — To perform logic functions
Detailed Academic Explanation:
To perform logic functions is the correct answer to “In BiCMOS, MOS switches are used to . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 25 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Fast gate can be built by keeping . . . . . . . .
Correct Answer: Option A — Low output capacitance
Detailed Academic Explanation:
Low output capacitance is the correct answer to “Fast gate can be built by keeping . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 26 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
If the gate is given sufficiently large charge, electrons will be attracted to . . . . . . . .
Correct Answer: Option B — Channel region
Detailed Academic Explanation:
Channel region is the correct answer to “If the gate is given sufficiently large charge, electrons will be attracted to . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 27 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
CMOS technology is used in developing which of the following?
Correct Answer: Option D — All of the mentioned
Detailed Academic Explanation:
All of the mentioned is the correct answer to “CMOS technology is used in developing which of the following”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 28 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
What is the condition for non conducting mode?
Correct Answer: Option D — Vgs = Vds = Vs = 0
Detailed Academic Explanation:
Vgs = Vds = Vs = 0 is the correct answer to “What is the condition for non conducting mode”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 29 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
For depletion mode transistor, gate should be connected to . . . . . . . .
Correct Answer: Option A — Source
Detailed Academic Explanation:
Source is the correct answer to “For depletion mode transistor, gate should be connected to . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 30 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The MOSFETS are arranged in this configuration to provide . . . . . . . .
Correct Answer: Option C — Both zero static power dissipation and high input impedance
Detailed Academic Explanation:
Both zero static power dissipation and high input impedance is the correct answer to “The MOSFETS are arranged in this configuration to provide . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
Increases is the correct answer to “Increasing fan-out . . . . . . . . the propagation delay.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 32 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Pass transistors are transistors used as . . . . . . . .
Correct Answer: Option A — Switches connected in series
Detailed Academic Explanation:
Switches connected in series is the correct answer to “Pass transistors are transistors used as . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 33 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
What is the disadvantage of the MOS device?
Correct Answer: Option A — Limited current sourcing
Detailed Academic Explanation:
Limited current sourcing is the correct answer to “What is the disadvantage of the MOS device”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 34 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Ids depends on . . . . . . . .
Correct Answer: Option B — Vds
Detailed Academic Explanation:
Vds is the correct answer to “Ids depends on . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 35 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
BiCMOS inverter requires high load current sourcing.
Correct Answer: Option A — True
Detailed Academic Explanation:
True is the correct answer to “BiCMOS inverter requires high load current sourcing.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 36 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Surface mobility depends on . . . . . . . .
Correct Answer: Option B — Effective gate voltage
Detailed Academic Explanation:
Effective gate voltage is the correct answer to “Surface mobility depends on . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 37 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Heavily doped polysilicon is deposited using . . . . . . . .
Correct Answer: Option B — Chemical vapour deposition
Detailed Academic Explanation:
Chemical vapour deposition is the correct answer to “Heavily doped polysilicon is deposited using . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 38 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
Substrate doping level should be decreased to avoid the latch-up effect.
Correct Answer: Option B — False
Detailed Academic Explanation:
False is the correct answer to “Substrate doping level should be decreased to avoid the latch-up effect.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 39 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The transistors used in BiCMOS are . . . . . . . .
Correct Answer: Option C — Both BJT and MOSFETs
Detailed Academic Explanation:
Both BJT and MOSFETs is the correct answer to “The transistors used in BiCMOS are . . . . . . . .”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
Question 40 of 40
★ FPSC
★ PPSC
★ FPSC
★ PPSC
The . . . . . . . . is used to reduce the resistivity of poly silicon.
Correct Answer: Option C — Doping impurities
Detailed Academic Explanation:
Doping impurities is the correct answer to “The . . . . . . . . is used to reduce the resistivity of poly silicon.”. This question is standard in competitive examination syllabi for Vlsi Design And Testing.
💡Key Conceptual Anchor:Vlsi Design And Testing
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Analog Electronics — Part 1
Master the next curriculum module with 40 exam-standard MCQs.
💡Examiner's Advisory for Electronics & Communications Engineering
In competitive commission exams (FPSC, PPSC, KPPSC, SPSC, CSS, PMS), questions are frequently phrased with distractor options designed to catch rote learners. Whenever you answer an MCQ, read the Detailed Academic Explanation and Conceptual Anchor to understand why the remaining options are incorrect.